Technology acceleration is creating significant challenges for wafer level and advanced package test, requiring high density vertical probe cards, a dramatic reduction in probe pitch, and increased signal integrity requirements. These conditions are driven by emerging developments in 5G cellular networking, automotive advancements in connectivity and 3D packaging, in addition to other emerging technologies.
DESIGN SERVICES AND PROBE CARD SOLUTIONS
Translarity delivers design services, turnkey probe cards, and probe card components for customers experiencing a critical state of transition to address issues such as:
More devices in closer proximity at higher frequency
Expanded performance requirements for known good die
Shifts in pitch and density scale