Driving Modern Technology Acceleration
Globally Supported Turnkey Probe Card Solutions
As technology continues to accelerate at an unprecedented pace, the semiconductor industry faces substantial challenges in wafer-level and advanced package testing. Innovations in 5G networking, automotive connectivity, and 3D packaging drive the demand for high-density vertical probe cards. These technologies require significant reductions in probe pitch and enhanced signal integrity.
Translarity delivers advanced probe card solutions with fine pitch capability, high pin count support, and tailored mechanical designs. Our custom engineering approach ensures precise, reliable performance—including RF and high-density applications—giving customers the flexibility and accuracy needed for next-generation device testing.
Streamlining Solutions
Translarity provides high-level design services, turnkey probe cards, and probe card components for customers experiencing a critical state of transition to address issues such as:
Versatile Innovation Across Technology Sectors
At Translarity, we excel not only in probe card technology but also as a specialized engineering firm focused on semiconductors and distinctive manufacturing solutions. Clients benefit from our value-added services, prototyping, and limited pilot production. By seamlessly integrating these capabilities into our offerings, we deliver increased efficiency and innovative solutions tailored to our customers’ needs.
Reach out to our team today to request a quote and discuss your probe card testing and technological production needs. We’re ready to accelerate your path to success.