Test Solutions to Optimize Your Wafer Testing Processes
Learn more about the capabilities we offer to meet your evolving needs.
With decades of experience and a strong focus on innovation, Translarity is pushing the boundaries of wafer-level testing technology to help semiconductor companies develop high-performance devices with enhanced efficiency and reliability.
As chip architectures become increasingly complex and the industry shifts toward advanced packaging, wafer testing remains a vital component of maintaining device reliability, performance, and yield.
Advanced Testing Solutions for a Competitive Edge
Our capabilities help semiconductor manufacturers adopt advanced testing solutions that reduce costs and accelerate their time-to-market capabilities.
Our Capabilities Matrix
Capabilities | Notes |
Probe Card Manufacturing | Full Service; Design, Manufacturing, Assembly, Testing, and Support |
PCB | Complex design, contract manufacturing, assembly, inspection and test |
Space Transformation | A wide range of space transformation solutions including WST, organic and ceramic |
Precision Micro Drilling | Ceramic, Engineering Plastics +/-3um |
CNC Milling | Stainless Steel, Invar, Aluminum, Foam, Copper, etc… +/- 5um |
Laser Drilling | >9um radial corners, +/- 2um, SiN, Zirconia, ceramic, engineering plastics |
Surface Grinding | Up to <18"x36" |
Plating | Up to 8"; ENIG, Electrolytic (via fill or pattern) & Electroless Cu, Ag, Au |
Sputter | Copper, Titanium, Chrome, Gold, Rhenium |
Assembly | Mechanical and electrical |
CMP/Lapping/Polishing | Copper/Ceramics 3um planarity |
Metrology | Roughness, true position, measurement microscopes, surface profilometers, vision measurement machine, and optical comparator |
SEM | EDAX |
Microscopes | 2000x magnification |
Parylene Coating | Parylene C |
Plasma Etch | Small parts only limited to 8” |
Mechanical Design | Concept to prototyping |
PCB/Electrical Design | Concept to prototyping |
Mechanical Automation | Full Service; Design, Manufacturing, Assembly, Testing, and Support |
Flying Probe Test | Double-Sided |
Cleanroom | Class 100 and Class 10,000 |
Simulation | Finite element analysis, RF, and full board signal integrity |
Our expertise extends beyond the design and manufacturing of state-of-the-art probe cards; we are committed to addressing the unique requirements of our customers through collaborative engineering. This includes the development of tailored mechanical hardware, interposers, cable assemblies, PCB assembly, and other prototyping solutions, allowing us to meet and exceed the diverse needs of our clients.
By fostering partnerships and encouraging innovation, we strive to identify and tackle any unmet needs that may arise, ultimately driving success in the ever-evolving semiconductor landscape. Reach out to us today to discuss your project needs and get a quote.